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Effect of anisotropic diffusion coefficient on the evolution of the interface void in copper metallization for integrated circuits

Journal of the Korean Crystal Growth and Crystal Technology
Abbr : J. Korean Cryst. Growth Cryst. Technol.
2004, 14(2), pp.58-62
Publisher : The Korea Association Of Crystal Growth, Inc.
Research Area : Materials Science and Engineering

최준호 1

1Simon Fraser University



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