[confproc]
P. Dadvar
/ 2005
/ Potential thermal security risks
/ Proceedings of the IEEE/ASME Semiconductor Thermal Measurement, Modeling, and Management Symposium (SEMI-THERM)
: 229~234
[journal]
최정환
/ 2008
/
Thermal Management for Multi-core Processor and Prototyping Thermal-aware Task Scheduler
/ 정보과학회논문지 : 시스템 및 이론
/ 한국정보과학회
35
(7)
: 354~360
[journal]
Z. Zhijun
/ 2002
/ Advanced thermal architecture for cooling of high power electronics
/ Components and Packaging Technologies, IEEE Transactions on
25
(4)
: 629~634
[journal]
L. Benini
/ 1999
/ Symbolic synthesis of clock-gating logic for power optimization of synchronous controllers
/ Transactions on Design Automation of Electronic Systems (TODAES)
4
(4)
: 351~375
[confproc]
P. Falkenstern
/ 2010
/ Three-Dimensional Integrated Circuits (3D IC) Floorplan and Power/Ground Network Co-synthesis
/ Proceeding of Design Automation Conference (ASP-DAC)
: 169~174
[confproc]
A. Gupta
/ 2007
/ STEFAL: A System Level Temperature- and Floorplan-Aware Leakage Power Estimator for SoCs
/ Proceeding of VLSI Design held jointly with 6th International Conference on Embedded Systems
: 559~564
[confproc]
P. N. Guo
/ 1999
/ An 0-Tree representation of non-slicing floorplan and its applications
/ Proceeding of Design Automation Conference(DAC)
: 268~273
[journal]
C. H. Tsai
/ 2000
/ Cell-Level Placement for Improving Substrate Thermal Distribution
/ IEEE Tram. On Computer.-Aided Des
19
(2)
: 253~266
[confproc]
K. W. Lee
/ 1996
/ Module placement on BSG-structure and IC layout applications
/ Proceedings of IEEE/ACM ICCAD
: 484~491
[confproc]
H. Murata
/ 1998
/ Sequence Pair Based Placement Method for Hard/Soft/Pre-placed Modules
/ Proceeding of International Symposium on Physical Design(ISPD)
: 167~172
[web]
/ Microarchitectural Floorplanning for Thermal Management: A Technical Report
/ http://www.cs.virginia.edu/~techrep/CS-2005-08.pdf
[journal]
손동오
/ 2011
/
Analysis on the Temperature of 3D Multi-core Processors according to Vertical Placement of Core and L2 Cache
/ 한국컴퓨터정보학회논문지
/ 한국컴퓨터정보학회
16
(6)
: 1~10
[confproc]
Coskun A. K
/ 2009
/ Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
/ Proceedings of 12th Euromicro conference on Digital System Design, Architectures, Methods and Tools
: 183~190
[confproc]
R. E. Kessler
/ 2002
/ The Alpha 21264 Microprocessor Architecture
/ Proceedings of the ICCD '98
: 90~95
[journal]
D. C. Burger
/ 1997
/ The SimpleScalar tool set, version 2.0
/ ACM SIGARCH CAN
25
(3)
: 13~25
[confproc]
D. Brooks
/ 2000
/ Wattch:a framework for architectural-level power analysis and optimizations
/ Proceedings of the 27th International Symposium on Computer Architecture
: 83~94
[journal]
W. Huang
/ 2006
/ HotSpot : A Compact Thermal Modeling Method for CMOS VLSI Systems
/ IEEE Transactions on VLSI Systems
14
(5)
: 501~513
[web]
/ SPEC CPU2000 Benchmarks, available at
/ http://www.specbench.org