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S-parameter Extraction of Test Socket Using Printed Circuit Board with Coaxial Structure

  • Journal of Software Assessment and Valuation
  • Abbr : JSAV
  • 2022, 18(2), pp.181-187
  • DOI : 10.29056/jsav.2022.12.18
  • Publisher : Korea Software Assessment and Valuation Society
  • Research Area : Engineering > Computer Science
  • Received : December 4, 2022
  • Accepted : December 20, 2022
  • Published : December 31, 2022

Moonjung Kim 1

1공주대학교

Accredited

ABSTRACT

To cope with various pitches and pin arrangements, S-parameter analysis of test sockets utilizes printed circuit boards. It is known that a de-embedding process is required to remove parasitic components of a printed circuit board. In general, a wiring design process of a printed circuit board applies a transmission line having a microstrip structure. However, in this paper, a printed circuit board is designed using a coaxial transmission line, and a test fixture is constructed by assembling the test socket and the printed circuit boards in the vertical direction. The vertical assembly method of the test socket and the printed circuit boards in this paper can shorten the signal transmission path and minimize the parasitic components of the fixture. In this paper, the diameters of the signal pad, the ground pad, and the via and printed circuit board thickness are designed. The S-parameters are calculated using 3-dimensional electromagnetic field simulation. It is expected that the coaxial structure design of the printed circuit board using the placement of the via structure and the fixture structure of the vertical assembly method can be utilized as an S-parameter extraction method for the test socket.

Citation status

* References for papers published after 2022 are currently being built.

This paper was written with support from the National Research Foundation of Korea.