@article{ART002958966},
author={Liu Pengfei and Wang Xulei and He Xinbo and Qu Xuanhui},
title={Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles},
journal={Carbon Letters},
issn={1976-4251},
year={2022},
volume={32},
number={3},
pages={917-925},
doi={10.1007/s42823-022-00330-0}
TY - JOUR
AU - Liu Pengfei
AU - Wang Xulei
AU - He Xinbo
AU - Qu Xuanhui
TI - Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles
JO - Carbon Letters
PY - 2022
VL - 32
IS - 3
PB - Korean Carbon Society
SP - 917
EP - 925
SN - 1976-4251
AB - Diamond reinforced silicon carbide matrix composites (diamond/SiC) with high thermal conductivity were prepared by tape casting combined with Si vapor infiltration for thermal management application. The effects of the mixing mode of bimodal diamond particles on the microstructure, thermal and mechanical properties of the composites were analyzed. The results reveal that the thermal conductivity of composites is affected significantly by mixing mode of diamond. In general, when the content of large diamond remains constant, adding a slight amount of small diamond was found to be effective in improving the thermal conductivity of the composite. However, excess small diamonds added will decrease thermal conductivity due to its high interfacial thermal resistance. The maximum thermal conductivity of obtained diamond/SiC is 469 W/(m K) when 38 vol% large diamond and 4 vol% small diamond were added. Such a result can be attributed to the formation of efficient heat transfer channels within the composite and sound interfacial bonding between diamond and SiC phase. Diamond/SiC with high thermal conductivity are expected to be the next generation of electronic packaging substrate.
KW - Diamond/SiC Thermal conductivity Composite Tape casting
DO - 10.1007/s42823-022-00330-0
ER -
Liu Pengfei, Wang Xulei, He Xinbo and Qu Xuanhui. (2022). Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles. Carbon Letters, 32(3), 917-925.
Liu Pengfei, Wang Xulei, He Xinbo and Qu Xuanhui. 2022, "Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles", Carbon Letters, vol.32, no.3 pp.917-925. Available from: doi:10.1007/s42823-022-00330-0
Liu Pengfei, Wang Xulei, He Xinbo, Qu Xuanhui "Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles" Carbon Letters 32.3 pp.917-925 (2022) : 917.
Liu Pengfei, Wang Xulei, He Xinbo, Qu Xuanhui. Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles. 2022; 32(3), 917-925. Available from: doi:10.1007/s42823-022-00330-0
Liu Pengfei, Wang Xulei, He Xinbo and Qu Xuanhui. "Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles" Carbon Letters 32, no.3 (2022) : 917-925.doi: 10.1007/s42823-022-00330-0
Liu Pengfei; Wang Xulei; He Xinbo; Qu Xuanhui. Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles. Carbon Letters, 32(3), 917-925. doi: 10.1007/s42823-022-00330-0
Liu Pengfei; Wang Xulei; He Xinbo; Qu Xuanhui. Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles. Carbon Letters. 2022; 32(3) 917-925. doi: 10.1007/s42823-022-00330-0
Liu Pengfei, Wang Xulei, He Xinbo, Qu Xuanhui. Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles. 2022; 32(3), 917-925. Available from: doi:10.1007/s42823-022-00330-0
Liu Pengfei, Wang Xulei, He Xinbo and Qu Xuanhui. "Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles" Carbon Letters 32, no.3 (2022) : 917-925.doi: 10.1007/s42823-022-00330-0
