@article{ART002964094},
author={Liu Pengfei and He Xinbo and Qu Xuanhui},
title={The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis},
journal={Carbon Letters},
issn={1976-4251},
year={2023},
volume={33},
number={2},
pages={597-604},
doi={10.1007/s42823-022-00448-1}
TY - JOUR
AU - Liu Pengfei
AU - He Xinbo
AU - Qu Xuanhui
TI - The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis
JO - Carbon Letters
PY - 2023
VL - 33
IS - 2
PB - Korean Carbon Society
SP - 597
EP - 604
SN - 1976-4251
AB - This article reported a simple method for preparing diamond/SiC composites by polymer impregnation and pyrolysis (PIP) process, and the advantages of this method were discussed. Only diamond and SiC were contained in the diamond/SiC composite prepared by PIP process, and the diamond particles remained thermally stable up until the pyrolysis temperature was increased to 1600 °C. The pyrolysis temperature has a significant impact on the thermal conductivity and dielectric properties of composites. The thermal conductivity of the composite reaches a maximum value of 63.9 W/mK when the pyrolysis temperature is 1600 °C, and the minimum values of the real and imaginary part of the complex permittivity are 19.5 and 0.77, respectively. The PIP process is a quick and easy method to prepare diamond/SiC composites without needing expensive equipment, and it is of importance for promoting its application in the field of electric packaging substrate.
KW - Diamond/SiC Thermal conductivity Dielectric properties Composite PIP
DO - 10.1007/s42823-022-00448-1
ER -
Liu Pengfei, He Xinbo and Qu Xuanhui. (2023). The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis. Carbon Letters, 33(2), 597-604.
Liu Pengfei, He Xinbo and Qu Xuanhui. 2023, "The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis", Carbon Letters, vol.33, no.2 pp.597-604. Available from: doi:10.1007/s42823-022-00448-1
Liu Pengfei, He Xinbo, Qu Xuanhui "The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis" Carbon Letters 33.2 pp.597-604 (2023) : 597.
Liu Pengfei, He Xinbo, Qu Xuanhui. The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis. 2023; 33(2), 597-604. Available from: doi:10.1007/s42823-022-00448-1
Liu Pengfei, He Xinbo and Qu Xuanhui. "The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis" Carbon Letters 33, no.2 (2023) : 597-604.doi: 10.1007/s42823-022-00448-1
Liu Pengfei; He Xinbo; Qu Xuanhui. The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis. Carbon Letters, 33(2), 597-604. doi: 10.1007/s42823-022-00448-1
Liu Pengfei; He Xinbo; Qu Xuanhui. The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis. Carbon Letters. 2023; 33(2) 597-604. doi: 10.1007/s42823-022-00448-1
Liu Pengfei, He Xinbo, Qu Xuanhui. The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis. 2023; 33(2), 597-604. Available from: doi:10.1007/s42823-022-00448-1
Liu Pengfei, He Xinbo and Qu Xuanhui. "The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis" Carbon Letters 33, no.2 (2023) : 597-604.doi: 10.1007/s42823-022-00448-1
