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Preparation and properties of NFG-based composites synergistically regulated by MCMB and SG

  • Carbon Letters
  • Abbr : Carbon Lett.
  • 2026, 36(2), pp.805~822
  • DOI : 10.1007/s42823-026-01030-9
  • Publisher : Korean Carbon Society
  • Research Area : Natural Science > Natural Science General > Other Natural Sciences General
  • Received : September 14, 2025
  • Accepted : December 31, 2025
  • Published : March 1, 2026

Liu Mingmin 1 WU Haihua 1 Gong Liang 1 Zhang Hualong 1 Zeng Shiyu 1 Gao Aodong 1 Li Siwei 1 Deng Shixiong 1 Ye Xicong 1 Xing Lei 1 Chen Yihao 1

1China Three Gorges University

Accredited

ABSTRACT

The rapid development of electronic devices towards higher power density and miniaturization, has made heat dissipation a critical challenge that limits their reliability and lifespan. This study presents the preparation of natural flake graphite (NFG)-based composites, synergistically modulated by intermediate-phase carbon microspheres (MCMB) and spherical graphite (SG), via micro-hot pressing 3D additive molding technology. This innovative approach addresses the limitations of traditional metal-based heat dissipation materials. The pore structure and properties of the composites were optimized by varying the contents of MCMB and spherical graphite. The results demonstrated that the composites exhibited superior overall performance when 40 wt% MCMB and 20 wt% SG were incorporated. The compressive strength significantly increased to 32.71 MPa, while the thermal conductivity in the parallel and perpendicular directions reached 351.08 W/(m·K) and 296.16 W/(m·K), respectively, and the anisotropy ratio was reduced to 1.18. Mechanistic analysis revealed that MCMB reduced anisotropy by disrupting the orientation of the NFG lamellae, while SG optimized the pore structure and established a multistage thermal conductivity pathway. The synergistic effects of both components resulted in a unified material with high thermal conductivity, low thermal expansion, and strong mechanical properties, offering a novel solution for the thermal management of electronic devices.

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