The study of thermal properties of graphene/Cu foam hybrid structures (그래핀/구리폼과 그래파이트 하이브리드 구조체의 열전도 특성 연구)

Hee Jin Kim (김희진); 김형근; 김예나; Lee Woo-Sung (이우성); YOON, DAEHO (윤대호); Woo Seok Yang (양우석)

doi:10.6111/JKCGCT.2013.23.5.235

The study of thermal properties of graphene/Cu foam hybrid structures

Journal of the Korean Crystal Growth and Crystal Technology
Abbr : J. Korean Cryst. Growth Cryst. Technol.
2013, 23(5), pp.235~240
DOI : 10.6111/JKCGCT.2013.23.5.235
Publisher : The Korea Association Of Crystal Growth, Inc.
Research Area : Engineering > Materials Science and Engineering

Hee Jin Kim ¹, 김형근 ², 김예나 ¹, Lee Woo-Sung ², YOON, DAEHO ¹, Woo Seok Yang ²

¹성균관대학교
²전자부품연구원

Accredited

ABSTRACT

Pure-carbon materials such as graphite, graphene, carbon nanotubes, and diamond have very high thermal conductivities. The reported thermal conductivity of graphene is in the range 3000~5000W/m-K at room temperature. Here,we developed graphene/cu foam hybrid type heat spreader to obtain higher thermal conductivity than Cu foam. Hybrid materials were characterized using optical microscopy (OM), scanning electron microscopy (SEM) and thermal conductivity measurement system; LFA (Laser Flash Analysis @ LFA 447, NETZSCH). We suggest that excellent thermal properties of graphene/cu foam hybrid structures are beneficial for all proposed electrical applications and can lead to a thermal management application.

KEYWORDS

Graphene, Graphite, Cu foam, Thermal conductivity, Hybrid type heat spreader

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