@article{ART003088017},
author={Yang Xiaohong and Cheng Xingwang and Chen Yu and Xiao Peng},
title={Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene},
journal={Carbon Letters},
issn={1976-4251},
year={2024},
volume={34},
number={5},
pages={1317-1327},
doi={10.1007/s42823-024-00689-2}
TY - JOUR
AU - Yang Xiaohong
AU - Cheng Xingwang
AU - Chen Yu
AU - Xiao Peng
TI - Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene
JO - Carbon Letters
PY - 2024
VL - 34
IS - 5
PB - Korean Carbon Society
SP - 1317
EP - 1327
SN - 1976-4251
AB - To reduce production cost and inhibit the aggregation of graphene, graphene oxide and copper nitrate solution were used as raw materials in the paper. Cu particles were introduced to the graphene nanosheets by in-situ chemical reduction method in the hydrazine hydrate and sodium hydroxide solution, and the copper matrix composite reinforced with Cu-doped graphene nanosheets were fabricated by powder metallurgy. The synthesized Cu-doped graphene was characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The relative density, hardness, electrical conductivity and tensile strength of the copper matrix composite reinforced with Cu-doped graphene were measured as well. The results show that copper ions and graphene oxide can be effectively reduced by hydrazine hydrate simultaneously. Most of oxygen functional groups on the Cu-doped graphene sheets can be removed dramatically, and Cu-doped graphene inhibit the graphene aggregation effectively. Within the experimental range, the copper matrix composites have good comprehensive properties with 0.5 wt% Cu-doped graphene. The tensile strength and hardness are 221 MPa and 81.6 HV, respectively, corresponding to an increase of 23% and 59% compared to that of pure Cu, and the electrical conductivity reaches up to 93.96% IACS. However, excessive addition of Cu-doped graphene is not beneficial for the improvement on the hardness and electrical conductivity of copper matrix composite.
KW - Cu-doped graphene Copper matrix composites Electrical conductivity Hardness Tensile strength
DO - 10.1007/s42823-024-00689-2
ER -
Yang Xiaohong, Cheng Xingwang, Chen Yu and Xiao Peng. (2024). Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene. Carbon Letters, 34(5), 1317-1327.
Yang Xiaohong, Cheng Xingwang, Chen Yu and Xiao Peng. 2024, "Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene", Carbon Letters, vol.34, no.5 pp.1317-1327. Available from: doi:10.1007/s42823-024-00689-2
Yang Xiaohong, Cheng Xingwang, Chen Yu, Xiao Peng "Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene" Carbon Letters 34.5 pp.1317-1327 (2024) : 1317.
Yang Xiaohong, Cheng Xingwang, Chen Yu, Xiao Peng. Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene. 2024; 34(5), 1317-1327. Available from: doi:10.1007/s42823-024-00689-2
Yang Xiaohong, Cheng Xingwang, Chen Yu and Xiao Peng. "Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene" Carbon Letters 34, no.5 (2024) : 1317-1327.doi: 10.1007/s42823-024-00689-2
Yang Xiaohong; Cheng Xingwang; Chen Yu; Xiao Peng. Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene. Carbon Letters, 34(5), 1317-1327. doi: 10.1007/s42823-024-00689-2
Yang Xiaohong; Cheng Xingwang; Chen Yu; Xiao Peng. Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene. Carbon Letters. 2024; 34(5) 1317-1327. doi: 10.1007/s42823-024-00689-2
Yang Xiaohong, Cheng Xingwang, Chen Yu, Xiao Peng. Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene. 2024; 34(5), 1317-1327. Available from: doi:10.1007/s42823-024-00689-2
Yang Xiaohong, Cheng Xingwang, Chen Yu and Xiao Peng. "Microstructure and properties of copper matrix composites reinforced with Cu-doped graphene" Carbon Letters 34, no.5 (2024) : 1317-1327.doi: 10.1007/s42823-024-00689-2