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High density plasma etching of single crystalline La3Ga5SiO14 for wide band, high temperature SAWfilter devices

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2005, 15(6), pp.234-238
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering

Cho, Hyun 1

1부산대학교

Accredited

ABSTRACT

Effects of plasma composition, ion flux and ion energy on the etch rate, surface morphology and near surface stoichiometry of a single crystalline La3Ga5SiO14 wafer have been examined in Cl2/Ar inductively coupled plasma (ICP) discharges. Maximum etch rate ~1600 ?min was achieved either at relatively high source power (~1000 W) or high Cl2 content conditions in Cl2/Ar discharges. The etched surfaces showed similar or better RMS roughness values than those of the unetched control sample and the near surface stoichiometry was found not to be affected by ICP etching.

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