The advancement of Artificial Intelligence (AI), mobile, and Internet of Things (IoT) technologies has driven the demand for high integration, high-speed signal transmission, and fine patterning in semiconductor packaging. While organic substrates are commonly used, they present limitations in planarity, thermal/mechanical stability, and dielectric properties. Glass substrates offer superior characteristics, but their brittleness hinders fine-pattern processing, particularly in forming Through Glass Via (TGV). This study presents a TGV fabrication method using photosensitive glass based on Ce- and Ag- doped lithium aluminosilicate (LAS). Selective crystallization of lithium metasilicate (LMS) was achieved via UV exposure and thermal treatment, followed by hydrofluoric acid etching to form vias. Key process parameters were analyzed for their impact on via formation and quality, and the proposed process enhanced controllability over via morphology while offering practical insights into advanced packaging applications using photosensitive glass.