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Effect of the additive gas on the bonding structure and mechanical properties of the DLC films deposited by RF-PECVD

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2015, 25(4), pp.145-152
  • DOI : 10.6111/JKCGCT.2015.25.4.145
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering

Bonggeun Choi 1

1한양대학교

Accredited

ABSTRACT

In this work, we were investigated the effect of the additive gases on the relationship between bonding structure and mechanical properties of the deposited films when the DLC films were deposited on Si-wafer by the rf-PECVD method with the addition of small amounts of carbon dioxide and nitrogen to the mixture gas of methane and hydrogen. The deposition rate of the films increased as the rf-power increased, while it decreased with increasing the amount of additive gases. Also, as the carbon dioxide gas increased, the hydrogen content in the films decreased but the sp 3 /sp 2 ratio of the films increased. In case of nitrogen gas, the hydrogen content decreased, however the sp 3 /sp 2 ratio and nitrogen gas flow rate did not show a specific tendency.

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