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Taper phenomenon of UV-laser punching process on zero-shrinkage substrate

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2015, 25(6), pp.285-289
  • DOI : 10.6111/JKCGCT.2015.25.6.285
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering

안익준 1 Donghun Yeo 2 Hyosoon Shin 2 Kwang Bo Shim 1

1한양대학교
2한국세라믹기술원

Accredited

ABSTRACT

With the miniaturization with both high functionality and high integrity of the probe cards, the highly precise laser punching on the zero-shrinkage high strength substrate has attracted more attention recently. Taper occurrence during laser-punching on green sheets appears as a problem in process. The size (diameter) difference between the entrance hole and the exit hole in tapered holes appeared to be inversely proportional to the hole size itself. To suppress taper occurrence, two-stage punching was adopted as the size of second hole was varied from 70 μm to 79 μm when punching 80 μm via holes on the substrate with thickness of 380 μm. The minimal taper ratio of 11.9 % appeared with second hole size between 70 to 79 μm before sintering. Taper ratio reduced to 7 % after zero-shrinkage sintering. The size difference between first hole and second hole appeared minimal when the size of second hole was 95~97 % to that of first hole.

Citation status

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