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Parametric study of inductively coupled plasma etching of GaN epitaxy layer

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2016, 26(4), pp.145-149
  • DOI : 10.6111/JKCGCT.2016.26.4.145
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering
  • Received : August 1, 2016
  • Accepted : August 19, 2016
  • Published : August 31, 2016

Choi ByoungSu 1 Hae Li Park 1 Cho, Hyun 1

1부산대학교

Accredited

ABSTRACT

The effect of process parameters such as plasma composition, ICP (Inductively Coupled Plasma) source power and rf chuck power on the etch characteristics of GaN epitaxy layer was studied. Cl2/Ar ICP discharges showed higher etch rates than SF6/Ar discharges because of the higher volatility of GaClx etch products than GaFx compounds. As the Ar ratio increases in the Cl2/Ar ICP discharges, the etch anisotropy was enhanced due to the improved physical component of the etching. For both plasma chemistries, the GaN etch rate increased continuously as both the ICP source power and rf chuck power increased, and a maximum etch rate of 251.9 nm/min was obtained at 13Cl2/2Ar, 750W ICP power, 400W rf chuck power and 10 mTorr condition.

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