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Study on residual stress characteristics according to the substrate type and V/III ratio during GaN growth by HVPE

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2020, 30(2), pp.41-46
  • DOI : 10.6111/JKCGCT.2020.30.2.041
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering
  • Received : March 27, 2020
  • Accepted : April 13, 2020
  • Published : April 30, 2020

Joo Hyung Lee 1 LEESEUNGHOON 1 Hee Ae Lee 1 Hyo Sang Kang 1 Oh Nuri 1 Sung Yi 1 Seong Kuk Lee 2 Jae Hwa Park 2

1한양대학교
2에임즈마이크론(주)

Accredited

ABSTRACT

The characteristics of the residual stress on the types of the substrate was investigated with adjusting the V/IIIratio during GaN growth via the HVPE method. GaN single crystal layers were grown on a sapphire substrate and a GaNtemplate under the conditions of V/III ratio 5, 10, and 15, respectively. During GaN growth, multiple hexagonal pits inGaN single crystal were differently revealed in accordance with growth condition and substrate type, and their distributionand depth were measured via optical microscopy(OM) and white light interferometry(WLI). As a result, it was confirmedthat the distribution area and depth of hexagonal pit tended to increase as the V/III ratio increased. Moreover, it was foundthat the residual stress in GaN single crystal decreased as the distribution area and depth of the pit increased throughmeasuring micro Raman spectrophotometer. In the case of GaN growth according to substrate type, the GaN on GaNtemplate showed lower residual stress than the GaN grown on sapphire substrate.

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