KJCKorea
Journal Central

@article{ART002599318},
author={Bonkeup Koo},
title={Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors},
journal={Journal of the Korean Crystal Growth and Crystal Technology},
issn={1225-1429},
year={2020},
volume={30},
number={3},
pages={83-90},
doi={10.6111/JKCGCT.2020.30.3.083}

TY - JOUR
AU - Bonkeup Koo
TI - Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors
JO - Journal of the Korean Crystal Growth and Crystal Technology
PY - 2020
VL - 30
IS - 3
PB - The Korea Association Of Crystal Growth, Inc.
SP - 83
EP - 90
SN - 1225-1429
AB - The effect of substrate surface roughness and sintering temperature on the adhesion strength of Ag-based thick film conductors formed on AlN substrates with excellent thermal conductivity was studied. The adhesion strength of the thick-film conductor manufactured using an AlN substrate having a surface roughness (Ra) of 0.5 was higher than that of a thick-film conductor manufactured using a substrate having a surface roughness greater or smaller than this. In the case of a substrate with a surface roughness of less than 0.5, the contact area between the Ag thick film conductor and the substrate was relatively smaller than that of a substrate with a surface roughness of 0.5, resulting in a lower adhesive strength. On the other hand, when a substrate having a surface roughness of more than 0.5 was used, it was found that the conduct or film was not completely adhered to the substrate, and as a result, it was found that the adhesive strength was small. In addition, it was found that the surface smoothness of the Ag-based thick film conductor film obtained by sintering at 850°C was the best compared to the smoothness of the conductor film obtained by sintering at different sintering temperatures,and as a result, it was found that the adhesive strength of the conductor film was the highest.
KW - Thick film technology;AlN substrate;Ag conductor;Glass frit;Surface roughness;Sintering temperature;Adhesion strength
DO - 10.6111/JKCGCT.2020.30.3.083
ER -

Bonkeup Koo. (2020). Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors. Journal of the Korean Crystal Growth and Crystal Technology, 30(3), 83-90.

Bonkeup Koo. 2020, "Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors", Journal of the Korean Crystal Growth and Crystal Technology, vol.30, no.3 pp.83-90. Available from: doi:10.6111/JKCGCT.2020.30.3.083

Bonkeup Koo "Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors" Journal of the Korean Crystal Growth and Crystal Technology 30.3 pp.83-90 (2020) : 83.

Bonkeup Koo. Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors. 2020; 30(3), 83-90. Available from: doi:10.6111/JKCGCT.2020.30.3.083

Bonkeup Koo. "Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors" Journal of the Korean Crystal Growth and Crystal Technology 30, no.3 (2020) : 83-90.doi: 10.6111/JKCGCT.2020.30.3.083

Bonkeup Koo. Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors. Journal of the Korean Crystal Growth and Crystal Technology, 30(3), 83-90. doi: 10.6111/JKCGCT.2020.30.3.083

Bonkeup Koo. Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors. Journal of the Korean Crystal Growth and Crystal Technology. 2020; 30(3) 83-90. doi: 10.6111/JKCGCT.2020.30.3.083

Bonkeup Koo. Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors. 2020; 30(3), 83-90. Available from: doi:10.6111/JKCGCT.2020.30.3.083

Bonkeup Koo. "Effect of surface roughness of AlN substrate and sintering temperature on adhesion strength of Ag thick film conductors" Journal of the Korean Crystal Growth and Crystal Technology 30, no.3 (2020) : 83-90.doi: 10.6111/JKCGCT.2020.30.3.083