@article{ART002639491},
author={Hanyoung Cha and Chan-Yeup Chung},
title={Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design},
journal={Journal of the Korean Crystal Growth and Crystal Technology},
issn={1225-1429},
year={2020},
volume={30},
number={5},
pages={208-213},
doi={10.6111/JKCGCT.2020.30.5.208}
TY - JOUR
AU - Hanyoung Cha
AU - Chan-Yeup Chung
TI - Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design
JO - Journal of the Korean Crystal Growth and Crystal Technology
PY - 2020
VL - 30
IS - 5
PB - The Korea Association Of Crystal Growth, Inc.
SP - 208
EP - 213
SN - 1225-1429
AB - In this research, design optimization was investigated using the finite element analysis and the optimal designtechnique based on the PQRSM algorithm to minimize the thermal deformation of IGZO oxide in a target module inwhich IGZO oxide and a copper backplate are bonded to each other. In order to apply the optimal design technique inconjunction with finite element analysis, the x-coordinate of lower supports and upper fixed boards used as designvaluables, and the optimal design was performed to minimize the thermal displacement of IGZO materials as the objectivefunction. After the optimization process, the thermal displacement within IGZO oxide could be reduced to 42 % comparingwith the initial model. The result is thought to be useful in the industry as it can reduce the thermal deformation of targetoxides materials only by changing the position of the subsidiary materials during the bonding process.
KW - Thermal deformation;Oxide sputtering targets;Ceramic-metal bonding;Thermal displacement;Finite element analysis;Optimal design;PQRSM
DO - 10.6111/JKCGCT.2020.30.5.208
ER -
Hanyoung Cha and Chan-Yeup Chung. (2020). Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design. Journal of the Korean Crystal Growth and Crystal Technology, 30(5), 208-213.
Hanyoung Cha and Chan-Yeup Chung. 2020, "Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design", Journal of the Korean Crystal Growth and Crystal Technology, vol.30, no.5 pp.208-213. Available from: doi:10.6111/JKCGCT.2020.30.5.208
Hanyoung Cha, Chan-Yeup Chung "Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design" Journal of the Korean Crystal Growth and Crystal Technology 30.5 pp.208-213 (2020) : 208.
Hanyoung Cha, Chan-Yeup Chung. Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design. 2020; 30(5), 208-213. Available from: doi:10.6111/JKCGCT.2020.30.5.208
Hanyoung Cha and Chan-Yeup Chung. "Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design" Journal of the Korean Crystal Growth and Crystal Technology 30, no.5 (2020) : 208-213.doi: 10.6111/JKCGCT.2020.30.5.208
Hanyoung Cha; Chan-Yeup Chung. Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design. Journal of the Korean Crystal Growth and Crystal Technology, 30(5), 208-213. doi: 10.6111/JKCGCT.2020.30.5.208
Hanyoung Cha; Chan-Yeup Chung. Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design. Journal of the Korean Crystal Growth and Crystal Technology. 2020; 30(5) 208-213. doi: 10.6111/JKCGCT.2020.30.5.208
Hanyoung Cha, Chan-Yeup Chung. Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design. 2020; 30(5), 208-213. Available from: doi:10.6111/JKCGCT.2020.30.5.208
Hanyoung Cha and Chan-Yeup Chung. "Thermal displacement minimization of an oxide target for bonding process by finite element analysis and optimal design" Journal of the Korean Crystal Growth and Crystal Technology 30, no.5 (2020) : 208-213.doi: 10.6111/JKCGCT.2020.30.5.208
