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Evaluation of plasma resistance properties of LaF3 films deposited by the RF-IBAD method

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2025, 35(1), pp.30~35
  • DOI : 10.6111/JKCGCT.2025.35.1.030
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering
  • Received : March 24, 2025
  • Accepted : March 24, 2025
  • Published : March 31, 2025

Jihun Jung 1 Sung Hyun Woo 1 Sehyun Oh 1 Hee Young Kang 2 JUNG HEON LEE 3 Kim Hyeong Jun 1

1한국세라믹기술원
2그린광학
3성균관대학교

Accredited

ABSTRACT

In this study, the plasma resistance of LaF₃ films deposited on glass was evaluated using the Radio Frequency –Ion Beam Assisted Deposition (RF-IBAD) method. Based on the CF₄ + Ar plasma etching rate, the LaF₃ film showedexcellent plasma resistance, which was about 10 times lower than that of quartz glass and about 2 times lower than that of alumina. This is interpreted as being due to the fact that the LaF₃ film effectively suppresses the reaction with the CF₄ plasma and has low volatility due to its high melting point (2,327ºC). Therefore, the LaF₃ film has better plasma resistance than conventional quartz glass and ceramics, and is likely to be used as an etching protection material for semiconductor process components.

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