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@article{ART001588010},
author={최홍준 and 안진우 and 장형범 and 김종면 and 김철홍},
title={Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors},
journal={Journal of The Korea Society of Computer and Information},
issn={1598-849X},
year={2011},
volume={16},
number={9},
pages={1-10}

TY - JOUR
AU - 최홍준
AU - 안진우
AU - 장형범
AU - 김종면
AU - 김철홍
TI - Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors
JO - Journal of The Korea Society of Computer and Information
PY - 2011
VL - 16
IS - 9
PB - The Korean Society Of Computer And Information
SP - 1
EP - 10
SN - 1598-849X
AB - Unfortunately, in current microprocessors, increasing the frequency causes increased power consumption and reduced reliability whereas it improves the performance. To overcome the power and thermal problems in the singlecore processors, multicore processors has been widely used. For 2D multicore processors, interconnection is regarded as one of the major constraints in performance and power efficiency. To reduce the performance degradation and the power consumption in 2D multicore processors, 3D integrated design technique has been studied by many researchers. Compared to 2D multicore processors, 3D multicore processors get the benefits of performance improvement and reduced power consumption by reducing the wire length significantly. However, 3D multicore processors have serious thermal problems due to high power density, resulting in reliability degradation. Detailed thermal analysis for multicore processors can be useful in designing thermal-aware processors. In this paper, we analyze the impact of workload distribution, distance to the heat sink, and number of stacked dies on the processor temperature. We also analyze the effects of the temperature on overall system performance. Especially, this paper presents the guideline for thermal-aware multicore processor design by analyzing the thermal problems in 2D multicore processors and 3D multicore processors.
KW - multi-core processor;3D integrated circuits;temperature;hotspot;reliability
DO -
UR -
ER -

최홍준, 안진우, 장형범, 김종면 and 김철홍. (2011). Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors. Journal of The Korea Society of Computer and Information, 16(9), 1-10.

최홍준, 안진우, 장형범, 김종면 and 김철홍. 2011, "Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors", Journal of The Korea Society of Computer and Information, vol.16, no.9 pp.1-10.

최홍준, 안진우, 장형범, 김종면, 김철홍 "Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors" Journal of The Korea Society of Computer and Information 16.9 pp.1-10 (2011) : 1.

최홍준, 안진우, 장형범, 김종면, 김철홍. Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors. 2011; 16(9), 1-10.

최홍준, 안진우, 장형범, 김종면 and 김철홍. "Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors" Journal of The Korea Society of Computer and Information 16, no.9 (2011) : 1-10.

최홍준; 안진우; 장형범; 김종면; 김철홍. Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors. Journal of The Korea Society of Computer and Information, 16(9), 1-10.

최홍준; 안진우; 장형범; 김종면; 김철홍. Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors. Journal of The Korea Society of Computer and Information. 2011; 16(9) 1-10.

최홍준, 안진우, 장형범, 김종면, 김철홍. Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors. 2011; 16(9), 1-10.

최홍준, 안진우, 장형범, 김종면 and 김철홍. "Thermal Pattern Comparison between 2D Multicore Processors and 3D Multicore Processors" Journal of The Korea Society of Computer and Information 16, no.9 (2011) : 1-10.