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Impact of gate protection silicon nitride film on the sub-quarter micron transistor performances

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2004, 14(2), pp.47~49
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering

Junho Choy 1

1Simon Fraser University

Accredited

ABSTRACT

Gate protection SiNx as an alternative to a conventional re-oxidation proces in Dynamic Random AcesMemory devices is investigated. This process can not only protect the gate electrode tungsten against oxidation, but alsosave the thermal budget due to the re-oxidation. The protection SiNx process is applied to the poly-Si gate, and its deviceperformance is measured and compared with the re-oxidation processed poly-Si gate. The results on the gate dielectricintegrity show that etch damage-curing capability of protection SiNx is comparable to the re-oxidation process. In addition,the hot carrier immunity of the SiNx deposited gate is superior to that of re-oxidation procesed gate.

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