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Refractive index control of F-doped SiOC : H thin films by addition fluorine

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2007, 17(2), pp.47~51
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering

Seok Gyu Yoon 1,  YOON, DAEHO 1,  강삼묵 1,  정원석 1,  박우정 1

1성균관대학교

Accredited

ABSTRACT

F-doped SiOC : H thin films with low refractive index were deposited on Si wafer and glass substrate by plasma enhanced chemical vapor deposition (PECVD) as a function of rf powers, substrate temperatures, gas rates and their composition flow ratios (SiH4, CF4 and N2O). The refractive index of the F-doped SiOC : H film continuously decreased with increasing deposition temperature and rf power. As N2O gas flow rate decreased, the refractive index of the deposited films decreased down to 1.3778, reaching a minimum value at rf power of 180W and 100 o C without N2O gas. The fluorine content of F-doped SiOC : H film increased from 1.9 at% to 2.4 at% as the rf power was increased from 60W to 180W, which results in the decrease of refractive index.

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