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Etch selectivities of mask materials for anisotropic dry etching of gas sensing ZnO and SnO2 films

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2011, 21(4), pp.164-168
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering

Jong-Chun Park 1 Cho, Hyun 1

1부산대학교

Accredited

ABSTRACT

Etch selectivities of mask materials to ZnO and SnO2 films were studied in BCl3/Ar and CF4/Ar inductively coupled plasmas for fabrication of nanostructure-based gas sensing layer with high aspect ratios. In 25BCl3/10Ar ICP discharges, selectivities of 5.1~6.1 were obtained for ZnO over Ni while no practical selectivity was obtained for ZnO over Al. High selectivities of 7~17 for ZnO over Ni were produced in 25CF4/10Ar mixtures. SnO2 showed much higher etch rates than Ni and a maximum selectivity of 67 was observed for SnO2 over Ni.

Citation status

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This paper was written with support from the National Research Foundation of Korea.