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Structural defects in the multicrystalline silicon ingot grown with the seed at the bottom of crucible

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2014, 24(5), pp.190-195
  • DOI : 10.6111/JKCGCT.2014.24.5.190
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering

A-Young Lee 1 KIM YOUNG KWAN 1

1인천대학교

Accredited

ABSTRACT

Because of the temperature gradient occurring during the growth of the ingot with directional solidificationmethod, defects are generated and the residual stress is produced in the ingot. Changing the growth and cooling rate duringthe crystal growth process will be helpful for us to understand the defects and residual stress generation. The defects andresidual stress can affect the properties of wafer. Generally, it was found that the size of grains and twin boundaries aresmaller at the top area than at the bottom of the ingot regardless of growth and cooling condition. In addition to that, inthe top area of silicon ingot, higher density of dislocation is observed to be present than in the bottom area of the siliconingot. This observation implies that higher stress is imposed to the top area due to the faster cooling of silicon ingot aftersolidification process. In the ingot with slower growth rate, dislocation density was reduced and the TTV (Total ThicknessVariation), saw mark, warp, and bow of wafer became lower. Therefore, optimum growth condition will help us to obtainhigh quality silicon ingot with low defect density and low residual stress.

Citation status

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