@article{ART002217885},
author={Jung-Il Lee and LeeHoJun and YoHan Yoon and leejuyeon and Hyun Su Cho and Hyun Cho and Jeong Ho Ryu},
title={Microstructure of Sn-Ag-Cu Pb-free solder},
journal={Journal of the Korean Crystal Growth and Crystal Technology},
issn={1225-1429},
year={2017},
volume={27},
number={2},
pages={94-98},
doi={10.6111/JKCGCT.2017.27.2.094}
TY - JOUR
AU - Jung-Il Lee
AU - LeeHoJun
AU - YoHan Yoon
AU - leejuyeon
AU - Hyun Su Cho
AU - Hyun Cho
AU - Jeong Ho Ryu
TI - Microstructure of Sn-Ag-Cu Pb-free solder
JO - Journal of the Korean Crystal Growth and Crystal Technology
PY - 2017
VL - 27
IS - 2
PB - The Korea Association Of Crystal Growth, Inc.
SP - 94
EP - 98
SN - 1225-1429
AB - In the past few years, Sn-3.0Ag-0.5Cu (weight%) solder composition has been a representative material to electronic industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the composition have been reported. However, recent rapid rise in Ag price has demanded solder compositions of low Ag content. In this study, Sn-3.0Ag-0.5Cu solder bar sample was fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, optical microscope, FE-SEM and EDS. The Sn-3.0Ag-0.5Cu solder sample was composed of β-Sn, ε-Ag3Sn and η-Cu6Sn5 phases.
KW - Pb-free solder;Sn-3.0Ag-0.5Cu;β-Sn;ε-Ag3Sn;η-Cu6Sn5
DO - 10.6111/JKCGCT.2017.27.2.094
ER -
Jung-Il Lee, LeeHoJun, YoHan Yoon, leejuyeon, Hyun Su Cho, Hyun Cho and Jeong Ho Ryu. (2017). Microstructure of Sn-Ag-Cu Pb-free solder. Journal of the Korean Crystal Growth and Crystal Technology, 27(2), 94-98.
Jung-Il Lee, LeeHoJun, YoHan Yoon, leejuyeon, Hyun Su Cho, Hyun Cho and Jeong Ho Ryu. 2017, "Microstructure of Sn-Ag-Cu Pb-free solder", Journal of the Korean Crystal Growth and Crystal Technology, vol.27, no.2 pp.94-98. Available from: doi:10.6111/JKCGCT.2017.27.2.094
Jung-Il Lee, LeeHoJun, YoHan Yoon, leejuyeon, Hyun Su Cho, Hyun Cho, Jeong Ho Ryu "Microstructure of Sn-Ag-Cu Pb-free solder" Journal of the Korean Crystal Growth and Crystal Technology 27.2 pp.94-98 (2017) : 94.
Jung-Il Lee, LeeHoJun, YoHan Yoon, leejuyeon, Hyun Su Cho, Hyun Cho, Jeong Ho Ryu. Microstructure of Sn-Ag-Cu Pb-free solder. 2017; 27(2), 94-98. Available from: doi:10.6111/JKCGCT.2017.27.2.094
Jung-Il Lee, LeeHoJun, YoHan Yoon, leejuyeon, Hyun Su Cho, Hyun Cho and Jeong Ho Ryu. "Microstructure of Sn-Ag-Cu Pb-free solder" Journal of the Korean Crystal Growth and Crystal Technology 27, no.2 (2017) : 94-98.doi: 10.6111/JKCGCT.2017.27.2.094
Jung-Il Lee; LeeHoJun; YoHan Yoon; leejuyeon; Hyun Su Cho; Hyun Cho; Jeong Ho Ryu. Microstructure of Sn-Ag-Cu Pb-free solder. Journal of the Korean Crystal Growth and Crystal Technology, 27(2), 94-98. doi: 10.6111/JKCGCT.2017.27.2.094
Jung-Il Lee; LeeHoJun; YoHan Yoon; leejuyeon; Hyun Su Cho; Hyun Cho; Jeong Ho Ryu. Microstructure of Sn-Ag-Cu Pb-free solder. Journal of the Korean Crystal Growth and Crystal Technology. 2017; 27(2) 94-98. doi: 10.6111/JKCGCT.2017.27.2.094
Jung-Il Lee, LeeHoJun, YoHan Yoon, leejuyeon, Hyun Su Cho, Hyun Cho, Jeong Ho Ryu. Microstructure of Sn-Ag-Cu Pb-free solder. 2017; 27(2), 94-98. Available from: doi:10.6111/JKCGCT.2017.27.2.094
Jung-Il Lee, LeeHoJun, YoHan Yoon, leejuyeon, Hyun Su Cho, Hyun Cho and Jeong Ho Ryu. "Microstructure of Sn-Ag-Cu Pb-free solder" Journal of the Korean Crystal Growth and Crystal Technology 27, no.2 (2017) : 94-98.doi: 10.6111/JKCGCT.2017.27.2.094
