Thermal Analysis of 3D Multi-core Processors with Dynamic Frequency Scaling (동적 주파수 조절 기법을 적용한 3D 구조 멀티코어 프로세서의 온도 분석)

증민; 박영진; Jeong-A Lee (이정아); 김철홍; 이병석

Thermal Analysis of 3D Multi-core Processors with Dynamic Frequency Scaling

Journal of The Korea Society of Computer and Information
Abbr : JKSCI
2010, 15(11), pp.1-9
Publisher : The Korean Society Of Computer And Information
Research Area : Engineering > Computer Science

증민 ¹, 박영진 ², Jeong-A Lee ¹, 김철홍 ², 이병석 ¹

¹조선대학교
²전남대학교

Accredited

ABSTRACT

As the process technology scales down, an interconnection has became a major performance constraint for multi-core processors. Recently, in order to mitigate the performance bottleneck of the interconnection for multi-core processors, a 3D integration technique has drawn quite attention. The 3D integrated multi-core processor has advantage for reducing global wire length, resulting in a performance improvement. However, it causes serious thermal problems due to increased power density. For this reason, to design efficient 3D multi-core processors, thermal-aware design techniques should be considered. In this paper, we analyze the temperature on the 3D multi-core processors in function unit level through various experiments. We also present temperature characteristics by varying application features, cooling characteristics, and frequency levels on 3D multi-core processors. According to our experimental results, following two rules should be obeyed for thermal-aware 3D processor design. First, to optimize the thermal profile of cores, the core with higher cooling efficiency should be clocked at a higher frequency.Second, to lower the temperature of cores, a workload with higher thermal impact should be assigned to the core with higher cooling efficiency.

KEYWORDS

프로세서 구조 (Processor Architecture), 3D 구조 멀티 코어 프로세서(3D Multi-core Processor), 온도관리(Thermal Management), 동적주파수조절(Dynamic Frequency Scaling)

Citation status

* References for papers published after 2023 are currently being built.

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