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@article{ART002974338},
author={Min, Byung-Won},
title={Improvement of Electroforming Process System Based on Double Hidden Layer Network},
journal={Journal of Internet of Things and Convergence},
issn={2466-0078},
year={2023},
volume={9},
number={3},
pages={61-67},
doi={10.20465/KIOTS.2023.9.3.061}

TY - JOUR
AU - Min, Byung-Won
TI - Improvement of Electroforming Process System Based on Double Hidden Layer Network
JO - Journal of Internet of Things and Convergence
PY - 2023
VL - 9
IS - 3
PB - The Korea Internet of Things Society
SP - 61
EP - 67
SN - 2466-0078
AB - In order to optimize the pulse electroforming copper process, a double hidden layer BP (Back Propagation) neural network is constructed. Through sample training, the mapping relationship between electroforming copper process conditions and target properties is accurately established, and the prediction of microhardness and tensile strength of the electroforming layer in the pulse electroforming copper process is realized. The predicted results are verified by electrodeposition copper test in copper pyrophosphate solution system with pulse power supply. The results show that the microhardness and tensile strength of copper layer predicted by "3-4-3-2" structure double hidden layer neural network are very close to the experimental values, and the relative error is less than 2.32%. In the parameter range, the microhardness of copper layer is between 100.3~205.6MPa and the tensile strength is between 112~485MPa.When the microhardness and tensile strength are optimal,the corresponding process conditions are as follows: current density is 2A-dm-2, pulse frequency is 2KHz and pulse duty cycle is 10%.
KW - double hidden layer;BP neural network;electroforming;optimization;copper process
DO - 10.20465/KIOTS.2023.9.3.061
ER -

Min, Byung-Won. (2023). Improvement of Electroforming Process System Based on Double Hidden Layer Network. Journal of Internet of Things and Convergence, 9(3), 61-67.

Min, Byung-Won. 2023, "Improvement of Electroforming Process System Based on Double Hidden Layer Network", Journal of Internet of Things and Convergence, vol.9, no.3 pp.61-67. Available from: doi:10.20465/KIOTS.2023.9.3.061

Min, Byung-Won "Improvement of Electroforming Process System Based on Double Hidden Layer Network" Journal of Internet of Things and Convergence 9.3 pp.61-67 (2023) : 61.

Min, Byung-Won. Improvement of Electroforming Process System Based on Double Hidden Layer Network. 2023; 9(3), 61-67. Available from: doi:10.20465/KIOTS.2023.9.3.061

Min, Byung-Won. "Improvement of Electroforming Process System Based on Double Hidden Layer Network" Journal of Internet of Things and Convergence 9, no.3 (2023) : 61-67.doi: 10.20465/KIOTS.2023.9.3.061

Min, Byung-Won. Improvement of Electroforming Process System Based on Double Hidden Layer Network. Journal of Internet of Things and Convergence, 9(3), 61-67. doi: 10.20465/KIOTS.2023.9.3.061

Min, Byung-Won. Improvement of Electroforming Process System Based on Double Hidden Layer Network. Journal of Internet of Things and Convergence. 2023; 9(3) 61-67. doi: 10.20465/KIOTS.2023.9.3.061

Min, Byung-Won. Improvement of Electroforming Process System Based on Double Hidden Layer Network. 2023; 9(3), 61-67. Available from: doi:10.20465/KIOTS.2023.9.3.061

Min, Byung-Won. "Improvement of Electroforming Process System Based on Double Hidden Layer Network" Journal of Internet of Things and Convergence 9, no.3 (2023) : 61-67.doi: 10.20465/KIOTS.2023.9.3.061