@article{ART003263296},
author={Deok-Gyu Lim and Chang-Bin Song and Jae-Kyung Kim and Euy-Sik Jeon},
title={Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders},
journal={Industry Promotion Research},
issn={2466-1139},
year={2025},
volume={10},
number={4},
pages={135-142},
doi={10.21186/IPR.2025.10.4.135}
TY - JOUR
AU - Deok-Gyu Lim
AU - Chang-Bin Song
AU - Jae-Kyung Kim
AU - Euy-Sik Jeon
TI - Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders
JO - Industry Promotion Research
PY - 2025
VL - 10
IS - 4
PB - Industrial Promotion Institute
SP - 135
EP - 142
SN - 2466-1139
AB - The recent increase in eco-friendly and autonomous vehicles has expanded demand for advanced automotive electronic components. However, the application of multiple semiconductors generates electromagnetic interference(EMI) between chips, and the use of high-specification chips poses problems of heat accumulation and dissipation. This paper focuses on developing a high thermal conductivity EMI absorption pad using Fe-Al alloy powder. The Fe-Al alloy, composed of 87% Fe and 13% Al, exhibits excellent magnetic properties and corrosion resistance, making it suitable for EMI absorption. The alloy powder was mixed with a silicone vinyl polymer to fabricate a flexible pad. The powder was analyzed using SEM, XRD, and PSA, while the pad's reflection loss and thermal conductivity were measured. Results showed that both electromagnetic wave absorption and thermal conductivity improved as the powder loading increased. This research is expected to enable automotive electronic components to simultaneously perform electromagnetic wave absorption and heat dissipation functions.
KW - Fe-Al Alloy Powder;EMI Absorption;Reflection Loss;Thermal Conductivity;Gas Atomizer
DO - 10.21186/IPR.2025.10.4.135
ER -
Deok-Gyu Lim, Chang-Bin Song, Jae-Kyung Kim and Euy-Sik Jeon. (2025). Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders. Industry Promotion Research, 10(4), 135-142.
Deok-Gyu Lim, Chang-Bin Song, Jae-Kyung Kim and Euy-Sik Jeon. 2025, "Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders", Industry Promotion Research, vol.10, no.4 pp.135-142. Available from: doi:10.21186/IPR.2025.10.4.135
Deok-Gyu Lim, Chang-Bin Song, Jae-Kyung Kim, Euy-Sik Jeon "Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders" Industry Promotion Research 10.4 pp.135-142 (2025) : 135.
Deok-Gyu Lim, Chang-Bin Song, Jae-Kyung Kim, Euy-Sik Jeon. Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders. 2025; 10(4), 135-142. Available from: doi:10.21186/IPR.2025.10.4.135
Deok-Gyu Lim, Chang-Bin Song, Jae-Kyung Kim and Euy-Sik Jeon. "Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders" Industry Promotion Research 10, no.4 (2025) : 135-142.doi: 10.21186/IPR.2025.10.4.135
Deok-Gyu Lim; Chang-Bin Song; Jae-Kyung Kim; Euy-Sik Jeon. Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders. Industry Promotion Research, 10(4), 135-142. doi: 10.21186/IPR.2025.10.4.135
Deok-Gyu Lim; Chang-Bin Song; Jae-Kyung Kim; Euy-Sik Jeon. Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders. Industry Promotion Research. 2025; 10(4) 135-142. doi: 10.21186/IPR.2025.10.4.135
Deok-Gyu Lim, Chang-Bin Song, Jae-Kyung Kim, Euy-Sik Jeon. Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders. 2025; 10(4), 135-142. Available from: doi:10.21186/IPR.2025.10.4.135
Deok-Gyu Lim, Chang-Bin Song, Jae-Kyung Kim and Euy-Sik Jeon. "Analysis of the Properties of High Thermal Conductivity EMI Absorbing Pads using Spherical Fe-Al Alloy Powders" Industry Promotion Research 10, no.4 (2025) : 135-142.doi: 10.21186/IPR.2025.10.4.135
