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High-k/Metal Gate (HKMG) Technology: Structural, Process, and Application Trends

  • Industry Promotion Research
  • Abbr : IPR
  • 2025, 10(4), pp.191~202
  • DOI : 10.21186/IPR.2025.10.4.191
  • Publisher : Industrial Promotion Institute
  • Research Area : Interdisciplinary Studies > Interdisciplinary Research
  • Received : September 27, 2025
  • Accepted : October 27, 2025
  • Published : October 31, 2025

A Hyeon Choi 1 Ja Hyun Lee 1

1순천향대학교

Accredited

ABSTRACT

This paper reviews the structural characteristics and process evolution of High-k/Metal Gate (HKMG) technology, and examines its key technical elements for next-generation semiconductor devices. HKMG has addressed the limitations of conventional polysilicon/SiON gate stacks, contributing to the suppression of leakage current and the enhancement of electrical performance in advanced technology nodes. A comparison between Gate-First and Gate-Last (RMG) approaches highlights their respective process issues and suitability, while the integration potential with highly scaled devices such as FinFETs and Gate-All-Around (GAA) transistors is also evaluated. Furthermore, the advantages and integration opportunities of HKMG in diverse applications—including non-volatile memories, low-power circuits, and 3D integration—are discussed. This paper provides a comprehensive understanding of the process architecture, device integration, reliability assessment, and future directions of HKMG-based semiconductor technology.

Citation status

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