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Fluorine-based inductively coupled plasma etching of ZnO film

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2011, 21(6), pp.230~234
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering

박종천 1,  BYEONG WOO LEE 2,  KIM BYUNG IK 3,  Hyun Cho 1

1부산대학교
2한국해양대학교
3한국세라믹기술원

Accredited

ABSTRACT

High density plasma etching of ZnO film was performed in CF4/Ar and SF6/Ar inductively coupled plasmas. Maximum etch rates of ~1950 Å/min and ~1400 Å/min were obtained for 10CF4/5Ar and 10SF6/5Ar ICP discharges,respectively. The etched ZnO surfaces showed better RMS roughness values than the unetched control sample under most of the conditions examined. In the 10CF4/5Ar ICP discharges, very high etch selectivities were obtained for ZnO over Ni (max. 11) while Al showed etch selectivities in the range of 1.6~4.7 to ZnO.

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This paper was written with support from the National Research Foundation of Korea.