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Fabrication and characterization of Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag- 0.5Cu alloys

  • Journal of the Korean Crystal Growth and Crystal Technology
  • Abbr : J. Korean Cryst. Growth Cryst. Technol.
  • 2018, 28(3), pp.130~134
  • DOI : 10.6111/JKCGCT.2018.28.3.130
  • Publisher : The Korea Association Of Crystal Growth, Inc.
  • Research Area : Engineering > Materials Science and Engineering
  • Received : June 5, 2018
  • Accepted : June 18, 2018
  • Published : June 30, 2018

Jung-Il Lee 1,  Jong Min Paeng 1,  Hyun Su Cho 1,  Su Min Yang 1,  Jeong Ho Ryu 1

1한국교통대학교

Accredited

ABSTRACT

In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of β-Sn, ε-Ag3Sn and η-Cu6Sn5 phases.

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