Rheological behavior and IPL sintering properties of conductive nano copper ink using ink-jet printing (전도성 나노 구리잉크의 잉크젯 프린팅 유변학적 거동 및 광소결 특성 평가)

Jae Young Lee (이제영); Do Kyeong Lee (이도경); Nahm, Sahn (남산); Choi Jung Hoon (최정훈); Kwangtaek Hwang (황광택); Kim Jinho (김진호)

doi:10.6111/JKCGCT.2020.30.5.174

Rheological behavior and IPL sintering properties of conductive nano copper ink using ink-jet printing

Journal of the Korean Crystal Growth and Crystal Technology
Abbr : J. Korean Cryst. Growth Cryst. Technol.
2020, 30(5), pp.174-182
DOI : 10.6111/JKCGCT.2020.30.5.174
Publisher : The Korea Association Of Crystal Growth, Inc.
Research Area : Engineering > Materials Science and Engineering
Received : September 4, 2020
Accepted : September 15, 2020
Published : October 31, 2020

Jae Young Lee ¹, Do Kyeong Lee ¹, Nahm, Sahn ², Choi Jung Hoon ¹, Kwangtaek Hwang ¹, Kim Jinho ¹

¹한국세라믹기술원
²고려대학교

Accredited

ABSTRACT

The printed electronics field using ink-jet printing technology is in the spotlight as a next-generation technology,especially ink-jet 3D printing, which can simultaneously discharge and precisely control various ink materials, has been actively researched in recent years. In this study, complex structure of an insulating layer and a conductive layer was fabricated with photo-curable silica ink and PVP-added Cu nano ink using ink-jet 3D printing technology. A precise photocuredsilica insulating layer was designed by optimizing the printing conditions and the rheological properties of the ink,and the resistance of the insulating layer was 2.43 × 10¹³ Ω·cm. On the photo-cured silica insulating layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the PVP-added nano Cu ink was performed using an IPL flash sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Finally, it was confirmed that the resistance of the PVP-added Cu conductive layer was very low as 29 μΩ·cm under 100°C annealing temperature and 700 V of IPL applied voltage, and the adhesion to the photo-cured silica insulating layer was very good.

KEYWORDS

Ink-jet 3D printing, IPL flashing sintering, Rheological properties, Photo-curable silica ink, PVP-added nano Cu ink

Citation status

* References for papers published after 2023 are currently being built.

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Journal of the Korean Crystal Growth and Crystal Technology 2023 KCI Impact Factor : 0.19

Rheological behavior and IPL sintering properties of conductive nano copper ink using ink-jet printing

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* References for papers published after 2023 are currently being built.

Journal of the Korean Crystal Growth and Crystal Technology 2023 KCI Impact Factor : 0.19

Rheological behavior and IPL sintering properties of conductive nano copper ink using ink-jet printing

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