본문 바로가기
  • Home

A Point of Production System for Semiconductor Wafer Dicing Process

  • Journal of The Korea Society of Computer and Information
  • Abbr : JKSCI
  • 2009, 14(10), pp.55-61
  • Publisher : The Korean Society Of Computer And Information
  • Research Area : Engineering > Computer Science

Inho Kim 1

1동명대학교

Accredited

ABSTRACT

This paper describes a point of production(POP) system which collects and manages real-time shop floor machining information in a wafer dicing process. The system are composed of POP terminal, line controller and network. In the configuration of the system, LAN and RS485 network are used for connection with the upper management system and down stratum respectively. As a bridge between POP terminal and server, a line controller is used. The real-time information which is the base of production management are collected from information resources such as machine, product and worker. The collected information are used for the calculation of optimal cutting condition. The collection of the information includes cutting speed, spout of pure water, accumulated count of cut in process for blade and wafer defect. In order to manage machining information in wafer dicing process, production planning information is delivered to the shop floor, and production result information is collected from the shop floor, delivered to the server and used for managing production plan. From the result of the system application, production progress status, work and non-working hour analysis for each machine, and wafer defect analysis are available, and they are used for quality and productivity improvements in wafer dicing process. A case study is implemented to evaluate the performance of the system.

Citation status

* References for papers published after 2022 are currently being built.